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Wednesday March 6, 2019
Start the day right and enjoy the continental breakfast while networking with other attendees.
This session is focused on new methodologies and processes in improving the overall efficiency of the test process during product development. The first presenter will discuss improvements in the contactor evaluation process using real case study from production and lab experiments data. We will also learn the challenges, issues and key learning encountered during the contactor evaluation process. This is followed by the discussion of customized automation in handling and docking solutions for the semiconductor industry to improve efficiency and save time. In the last presentation, a new digital transformation solution known as Virtual Validation Farm (V2F) will be discussed to enable OEMs to have first access to A0 silicon debug to accelerate Time-to-Market (TTM) for a new product.
Break & Networking
Enjoy the break and networking time.
Advancements in the electronics industry and miniaturization of devices and their applications have led to an increased need for innovative thermal management technologies. These technologies include developing and testing new thermal-interface materials and developing new probe technologies and testing them at extreme low and high temperatures. Test conditions for thermal interface materials used in semiconductor test and burn-in applications will be discussed in the first presentation. A four-phase test program with data that simulates mechanical cycling over 1,000 contact cycles and 5,000 contact cycles using an automated test platform will be presented. The second presentation discusses products which require test at extremely low temperature and/or extremely high temperatures. The challenges of probing devices at each end of the temperature spectrum and solutions to overcome or mitigate issues encountered at probe will be covered. Lastly, the importance of effective thermal management will be covered for testing devices with faster switching speed transistors that are increasing in numbers in even smaller packages. The presenter will describe how newer probe technologies are being deployed to improve thermal management at the device-under-test while reducing the need for large test handler thermal offsets.
It's been three and a half days packed with learning, exploring, and sharing. Before we pack our bags and take what we've learned back to our jobs, there are a few closing remarks. We will take a moment to reflect and recognize the people, presentations, and posters that have distinguished themselves at TestConX 2019.
Program subject to change without notice.