TestConX 2019

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Sunday March 3, 2019

 

There will be breaks including refreshments to provide networking time for Tutorial attendees.

Please note: attendance at the tutorial will be limited. Please sign-up early to not miss out!

Noon

Tutorial
Palo Verde Room
Optional Tutorial
"Beyond Sort, Burn-In, and Class Testing: Post Silicon Validation Hardware Strategy"

 
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John Kelbert
Principal Engineer
Intel

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Amy Xia
Staff Mechanical Engineer
Intel

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Tong Wa Chao
Staff Mechanical Engineer
Intel

This tutorial will provide a deeper understanding of post-silicon validation goals with an emphasis on the hardware development strategies for boards, sockets, and thermal tools to meet the needs and challenges of post-silicon validation work.

Post-silicon validation's goal is to verify product functionality against the Engineering Design Specification and takes place between initial silicon power on (PO) and product launch in parallel with Burn-in and packaged silicon classification testing (Class Test).

 

6:30 p

Welcome Reception

If this is your twenty time attending TestConX, only your first, or somewhere in-between you will feel welcomed at the opening reception by friends old and new.

7:30 p

Dinner

The first of many excellent meals awaits as you get to network with other industry professionals. This is a great time to catch up with old colleagues or start meeting new friends.

8:30 p

Invited Speaker
Red Mountain Ballroom
Invited Speaker - Jan Vardaman

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI, SMTA, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

9:30 p

Adjourn

Program subject to change without notice.