Wafer level chip scale packages (WLCSP) are all the rage, and testing them is becoming easier and more cost effective as new probe technologies and probe card designs become available. This session explores four newly developed test solutions for WLCSP. Frank Zhou, Smiths Connectors, presents a tip co-planarity analysis of a 200 µm pitch spring probe head for WLCSP. Zhou describes the structure of the probe head and spring contact probes along with key features and their impacts on co-planarity of probe head contactor tips. Paul Gunn, Test Tooling Solutions Group, reports on design for manufacturing (DFM) efforts in the development of a 0.2mm WLCSP test socket. Khaled Elmadbouly, Smiths Connectors, discusses the challenges of building fan-out printed circuit boards (PCB) for use as space transformers in probe heads for multi-site WLCSP with pitches greater than 0.2 mm.
"Coplanarity Analysis of WLCSP Spring Probe Head"
Jiachun (Frank) Zhou, Daniel DelVecchio, Cody Jacob
"Pushing the envelope in DFM (Design for Manufacturing) for 0.2 mm Pitch WLCSP Socket"
Paul Gunn, Muhammad Syafiq, Takuto Yoshida
Test Tooling Solutions Group
"Space Transformer PCB For Testing 200 µm WLCSP"
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