Mr. Prior will share an overview of the global packaging market. His presentation will focus on the impact and growth of small form factor packages such as multi-row QFN, WLCSP, Fan-Out WLCSP and MIS BGA on the electronics industry infrastructure. Teardowns of products from early adopters such as Apple, Samsung, Huawei, and Xiaomi will be used to highlight how fast this change is occurring.
Mr. Prior is a Senior Consultant at Prismark Partners. He joined Prismark in 1996 and is the author of their Semiconductor and Packaging Report.In his role at Prismark, he provides market and competitive analyses within semiconductor packaging and interconnects.
Small Form Factor Package Trends to 2020
Return to the 2015 BiTS Workshop Archive index page