Limited copies of bound BiTS Workshop 2004
Proceedings are still available for a nominal fee (plus shipping and
handling), shipped anywhere in the world! Please call the BiTS office in
the USA at (845) 226-7560 or by email for details.
Fred Taber, IBM, BiTS General Chairman's Opening
Sunday, March 7, 2004
8:00 PM – PANEL DISCUSSION
The technical program begins after dinner with a panel of
experts briefly sharing their thoughts and experiences on a topic of current
interest to the socket community. Then it's the audience's turn to engage and
challenge the panel with some questions, comments and perhaps some debate.
IT ALL WORK TOGETHER: INTERFACE CHALLENGES AND SOLUTIONS
A panel comprised of end user and supplier representatives will
discuss interfacing challenges and possible solutions to achieve a successful
integration of the load board, change kit/nest, docking hardware, handler,
contactor, test head, and the package to meet the end customer's requirements.
End user panelists include leading semiconductor manufacturers and supplier
panelists include load board, handler, contactor/socket and test system
"Obstacles In The Transfer Of Contactor Solutions From
The OEM To The Subcontractor"
Jon Diller -
|Pre-Panel / Panelist
||Johnstech International Corporation
||C. Ray Gore
||Everett Charles Technologies
Monday, March 8, 2004
Session 1 - PUSHING
It's challenging out there! This opening session's presenters
discussed some new technology solutions, key drivers and operations breakthroughs
that press against the boundaries of today's know-how and practices.
Power - The Influence and Impact of Semiconductor Technology"
Marc D. Knox
the Cost of Test in Burn-in, an Integrated Approach"
Mike Noel, Don VanOverloop, Allan Dobbin
Motorola Semiconductor Products Sector
BGA Burn-in Socket in Compression Mount, Another Breakthrough in
Helge Puhlmann, Kazuhiro Matsuda, Jec Sangalang
Session 2 - THERMAL
Thermal management provisions are now a commonplace feature in
sockets/systems, yet with device power continuing to grow, ever more complex
analysis is needed to arrive at technologies to dissipate more heat. Our
presenters shared their thermal modeling and analysis work on a number of these
Analysis of a Burn-in Socket Contact - Beware the Use of Simple
Dr. James A. Forster, Prasanth Ambady, Ray Mandeville
On Fire, New Approach To Thermal Management"
Kulicke & Soffa
Sink Modeling and Design for Dissipating High Heat"
Trio-Tech International Pte. Ltd.
Session 3 - MATERIALS
SELECTION: PROPERTIES AND BEHAVIORS
Selecting materials with suitable properties and behaviors to
meet a range performance, use, etc. requirements requires considerable care.
Following up on last year's highly acclaimed session on materials, here is expert information to assist and guide your materials selection
Material Selection for ESD Sensitive IC Processing"
Glenn A. Cunningham
Stability and High Frequency Properties of Polymeric Materials for
Machined Test Sockets"
Paul Kane P.E.,
DuPont Engineering Materials
Joy Bloom, PhD. DuPont Experimental Station
Elastic Behavior of Anisotropic Conductive Polymers"
Roger Weiss, PhD., Chris Cornell, Glenn Amber
Paricon Technologies Corporation
Cathodic (Conductive) Anodic Filament (CAF) Migration With
THERMOUNT® Laminate And Prepreg"
Ceferino G. Gonzalez, Subhotosh Khan
DuPont Advanced Fibers Systems
Tuesday, March 9, 2004
Session 4 - MEASURING CURRENT
A lack of relevant standards for measuring current carrying
capacity within a socket has led our presenters to develop their own
methodologies. Here are three approaches - perhaps one or more will
find their way into the standards literature.
Of Current Carrying Capacity Measurement"
Jiachun (Frank) Zhou, Uyen Nguyen, Albert Campos
Kulicke & Soffa
Rating for Contacts, Time to Standardize the Test Method"
Qifang (Michelle) Qiao,
Karl Schoenfeld, Gonzer Associates
Current Carrying Capacity (CCC) Characterization"
Glenn A. Cunningham, Hongfei Yan
Session 5 - MANAGING
HIGH FREQUENCY REQUIREMENTS
Socketing higher frequency devices, often in high volume,
presents a host of challenging electrical and mechanical requirements to the
socket/contactor engineer. This session’s presenters shared innovative studies
that investigate and characterize high frequency performance.
Line Effects of Electroless Nickel Plating in Contactor
Jon Diller, Kevin DeFord
Effects of Signal Path Bandwidth On Semiconductor Test"
Everett Charles Technologies
Method For Contactor Characterization To 25 GHz"
Tim Swettlen ,
Gary Otonari, Orlando Bell, GigaTest Labs
Eric Bogatin, Synergetix
Session 6 - MODELING
This is one of BiTS' most popular sessions. Our presenters covered a range of topics relevant to today's
products and processes, including factors affecting contact resistance, tooling
design considerations, and stress relaxation.
Considerations For Leadless Device Types"
Multitest Electronic Systems
Of Stress Relaxation In Copper Beryllium Strip Using Dynamic
Michael Gedeon, Jim L. Johnson
Brush Wellman Inc.
Test Cell Contact Resistance With Optimized, Non-destructive
Jerry J. Broz, Gene Humphrey
International Test Solutions, Inc.
New Finite Element Analysis Technique For Modeling Stress
Relaxation Of Electro-Mechanical Spring Contacts Made Using Copper
Chris M. Dempsey, Vinayak Pandey, Intel Corporation
Naoaki Takayama, Enplas
Arun Aggrawal , CAE Associates
Jim L. Johnson, Brush Wellman Inc
After dinner, our guest speaker, a renowned industry leader,
spoke on a key topic to the burn-in and test socket community.
HELPING CUSTOMERS IMPROVE THEIR PERFORMANCE RESULTS
President, CEO, and Founder
Johnstech International Corporation
March 10, 2004
Session 7 - DEFORMATION
It's a dirty job but our group of experts have tackled it. They presented their work on the effects/impacts that deformation and
contamination may have and offer some improvement methods, techniques and
of Contaminants on Test Pad Surfaces"
Rika Denshi America, Inc.
Of Solder Ball Deformation On Interconnect Quality And Reliability"
Micron Technology Inc.
of VQFN with Palladium-Cobalt Pogo Pin"
Thuan-Lian Chua, Jayachandiran, Dieter Schuetz
Session 8 - SOCKETING
The move to lead-free solder compositions is accelerating. In an
encore to last year's session, you'll learn more about the effect of lead-free
solder materials on the performance of sockets and contacts, and in turn how
several contact types affect lead-free solder balls.
of Compression Style Contactors on Lead Free Solder"
Ironwood Electronics, Inc.
Leadframe Devices And Their Impact on Pogo Pin Socket
Everett Charles Technologies
Awards Presentation and Wrap-up
Fred Taber's closing remarks for BiTS
After three days loaded with information and
networking, it was now time to pack our bags and take what we've learned back to our jobs.
But first, there were a few closing remarks after some recognition to the people and papers
that have distinguished themselves in one way or another at BiTS 2004.